Introduction

HL-720 system performs efficient and precised lead inspection, mark inspection and surface inspection with accurate 3D optical measurements for ICs in tube.

System performs mark / surface scanning with Carried CCD on Tube In spots, then pick ICs, go through Fixed CCD for lead scanning and then place ICs on Tube Out spots. Pairs of Tube In and Tube Out move units in and out by turns to eliminate pick & place wait time as well as easy tube load / unload operation.

Key features

<System function>
System performs mark / surface scanning with Carried CCD on Tube In spots, then pick ICs, go through Fixed CCD for lead scanning and then place ICs on Tube Out spots with passes / failures sorted to individual tube category. Pairs of Tube In and Tube Out move units in and out by turns to eliminate pick & place wait time and easy tube load / unload operation as well.

<Lead inspection>
System provides 3D measurements of lead pitch, lead width, lead co-planarity, lead span, lead skew, terminal dimension, standoff …etc. for SOIC, SSOP, TSSOP… packages.

<Mark / Surface inspection>
Either single marking criteria can be set for all characters or 3 different criteria can be individually set for small, medium and large characters to screen out defects of double marking, low contrast marking, voids or bleeds in the mark, broken or smeared characters...etc.
System also provides surface inspection to screen out body defects such as scratch, crack, chipout…etc.

<3D optical measurement>
The 3DX, accommodated with 3 high resolution digital cameras plus working with powerful I-Cite vision software, provides the algorithms for high speed and accurate 3D image acquiring and processing. Sub-pixel algorithms maximize accuracy of measurements to 1/4 pixel.

<High throughput>
Serialized lead / mark scanning, up to 10 units each pick & place, visual scanning on the fly without having to stop and position as well as extremely high speed image processing contribute system throughput up to ~ 8K UPH for lead and mark inspections.

<Statistical report>
System provides data collection report including yield summary, rejects summary and overall statistical summary with detailed CPK data for Process and QA engineering.

Specification

Motion	X drive	High performance servo drive system
	Transmission	Ball screw & linear guide mechanism
	Resolution	X axis: ±0.03mm, Z axis: ±0.02mm
	Max. stroke	X axis: 1168mm, Z axis: 62mm
	Nozzles of Pick & Place mechanism	10 PCS
Vision	Camera	Fixed 3D cameras 1392 x 1040 pixels for lead inspection Carried 2D camera 1024 x 768 pixels for mark / surface inspection
	Field of view	Optional 15mm x 15mm / 25mm x 25mm
	Image acquiring time	~ 50 ms / image
	Image processing time	30 ~ 60 ms / image
	Optical process speed	~ 60K UPH (without handler index time)
	3 sigma measurement accuracy	5 ~ 7 um
Applicable products	Tube form	SOIC, SSOP, TSSOP… etc. IC units packed in tube form
Throughput	Lead scan	~ 10K UPH (assume 100% inspection yield)
	Lead + Mark scan	~ 8K UPH (assume 100% inspection yield)
I/O devices	Tube In	Two 10-tube-wide devices mounted. 150mil, 208mil, 300mil packages available
	Tube Out	Two 12-tube-wide devices mounted. 10 tubes for passes, 2 tubes for lead / mark failures. 150mil, 208mil, 300mil packages available
Control	Built-in controller	PC based control with Windows XP
	Display	17” TFT LCD touch panel
Power	AC voltage	200 ~ 245V / 50-60Hz
	Power consumption	1.0 KVA
Air	Air pressure	0.6 Mpa (~6.0 kg/cm2)
	Air consumption	50 liter/min
Dimension	Base Unit	(W)1550mm x(D) 750mm x (H)1600mm
	with tube I/O installed	(W) 1550mm x (D) 1290mm x (H) 1480mm

Inquiry

<Business Hour> Week day10:00-17:00
Please feel free to contact us from the following form for more detail.